Henan, China
Business Type:
Trading Company
Registered Capital:
73901.09 USD
Plant Area:
270 square meters
Main Markets:
North America, Europe, Southeast Asia/ Mideast
Average Lead Time:
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Sample Available
Secured Trading Service
Rating:
5.0/5

Hardware Products, Diamond Grinding Wheel, Cutting Tools manufacturer / supplier in China, offering Electroplated Nickel Bond Dicing Blade Wafer Hub Dicing Saw Blade Compound Semiconductor Wafers Dicing Blade, High Cost Performance Oxide Wafer Nickel Blades Wafer Hub Dicing Saw Blade Wafer Hub Dicing Saw Blade, Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades and so on.

Diamond Member Since 2023

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Mr. Brandon
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Total 1217 Products