Hot Sale Resin Diamond Dicing Blades Without Matrix High Precision Cutting for Silicon Wafer
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Product Highlights
- High Precision Cutting: Circular degree <0.1 and cylindricity <0.5 for semiconductor and wafer applications.
- Customizable Thickness: Thickness range from 0.1mm to 1mm to meet specific cutting requirements.
- Multiple Bond Types: Available in Metal, Resin, and Electroplated bonds for different material needs.
- Versatile Applications: Suitable for cutting silicon wafers, glass, quartz, sapphire, and ceramic substrates.
- Low Minimum Order: Minimum order quantity is 1 piece, ideal for testing and small batch production.
- OEM and ODM Services: Full customization and design-based customization services are available.
- Fast Delivery: Delivery within 3-30 days depending on production season and order quantity.
- High Efficiency: Features high efficiency, high accuracy, and long service life for industrial use.
Product Attributes
- Customization
- Available
- Material
- Diamond
- Abrasive
- Normal Abrasive
- Shapes
- Round
- Types
- Cutting
- Grain Size
- Other
- Cylindricity
- <0.5
- Circular Degree
- <0.1
- Technics
- Sinter
- Working Style
- Tool Grinding
- Width
- Customized
- Thickness
- 0.1-1mm
- Product Name
- Resin Bond Diamond Dicing Blade
- Shape
- Round Flat Wheel
- Bonding Agent
- Electroplated Bond/Resin Bond/Metal Bond
- Usage
- Semiconductor Material Cutting
- Application
- Cutting Scribing Glass,Quartz, Lita03 Linb03
- Advantage
- High Efficient,High Accuracy
- MOQ
- 1PCS
- Transport Package
- Cartons
- Specification
- 50-120mm, customized
- Trademark
- RZ
- Origin
- China
- Production Capacity
- 100000pieces/Year
- Package Size
- 20.00cm * 20.00cm * 5.00cm
- Package Gross Weight
- 0.300kg
Shipping
- Shipping Cost:
- Contact the supplier about freight and estimated delivery time.
Online Trading Protection
- Payment Guarantee
-
Platform-protected payments with refund support for eligible order issues.
- Platform Logistics
- Clearer shipment tracking with platform-supported logistics.
- Inspection Service
- Optional pre-shipment inspection for quality and quantity checks.
- After-Sales & Dispute Handling
- Platform-assisted dispute resolution, including refunds or returns when applicable.
Only orders placed and paid through Made-in-China.com Secured Trading are eligible for payment protection and the corresponding platform services.
Product Images of Hot Sale Resin Diamond Dicing Blades Without Matrix High Precision Cutting for Silicon Wafer
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Hot Sale Resin Diamond Dicing Blades Without Matrix High Precision Cutting for Silicon Wafer -
Hot Sale Resin Diamond Dicing Blades Without Matrix High Precision Cutting for Silicon Wafer -
Hot Sale Resin Diamond Dicing Blades Without Matrix High Precision Cutting for Silicon Wafer -
Hot Sale Resin Diamond Dicing Blades Without Matrix High Precision Cutting for Silicon Wafer -
Hot Sale Resin Diamond Dicing Blades Without Matrix High Precision Cutting for Silicon Wafer -
Hot Sale Resin Diamond Dicing Blades Without Matrix High Precision Cutting for Silicon Wafer -
Hot Sale Resin Diamond Dicing Blades Without Matrix High Precision Cutting for Silicon Wafer
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Product Description
Diamond dicing blades are mainly used in the precision manufacturing industry.
According to the structure, it can be divided into the soft blade and hard blade. Generally, the circular sheet grinding wheel is called "soft blade" and the combination of the grinding wheel and the aluminum alloy tool holder is called "hard blade". According to bond, it is divided into metal bond, resin bond, electroplated bond diamond dicing blade..
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Type
|
General shape
|
Diameter (mm)
|
Thickness (mm)
|
Thickness tolerance (mm)
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Grain grit size
|
|
Metal bond No steel core
|
1A8, 1A8S
|
10 ~ 200
|
0.05 ~ 4.00
|
±0.002 / ±0.005
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100# ~ 3000#
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Resin bond No steel core
|
1A8, 1A8S
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50 ~ 153
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0.06 ~ 4.00
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±0.005 / ±0.008
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100#~2000#
|
|
Nickel bond Hubless blades
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1A8, 1A8S
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50 ~ 120
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0.02 ~ 0.50
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±0.005 / ±0.010
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200# ~ 4000#
|
|
With Steel core
|
1A1, 1A1R, 1A1S, 1A1RS
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50-400
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0.25 ~ 6.00
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±0.010 / ±0.020
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100# ~ 2000#
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Nickel bond Hub blades
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3A1, 3A1S
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50 ~ 58
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0.01 ~ 0.12
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±0.005 / ±0.010
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320# ~ 5000#
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life.
1.Metal bond dicing balde Application: Scribing electronic parts, optical devices, semiconductor packages, BGA, CSP, PCB, ceramic, glass, quartz, crystal, ferrite, optical communication (Faraday), etc
International Leading Trade Fair
for Grinding Technology
Zhengzhou Ruizuan Diamond Tools Co..Ltd. is committed to providing customers with tools for grinding, cutting, turning, millingdrilling, and reaming. It includes abrasive tools&wheels, diamond/CBN wheels &tools, PCD/PCBNinserts&tools, tungsten carbide inserts &tool, HSS steel tools&cutters.
Our tools are applied in many different industries. Our customers find good applications in woodworking, metalworking, Automotive, Stone, Glasses, gemstones, Industrial ceramic, oil & Gas drilling and Constructions industries. In these industriesour products are performing well on long lifetimehigh-efficiency and lessunit-cost.
PACKAGE:
SINGLE BOX PER WHEEL,
10 to 20 WHEELS PER CARTON
DELIVERY TIME:
3-30 days after confirming order,detail delivery date should be decided according to
production season and order quantity.
About the Supplier
This supplier has been audited by TÜV Rheinland. Verify the report on the official TÜV Rheinland website with ID "MIC-ASR2691200". Items marked "
" are certified.
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Company Profile
Zhengzhou Ruizuan Diamond Tool Co., Ltd., established in 2014, is a professional engaged in the research, development, sale and service of Grinding Wheel, Metal Cutting Tools, Diamond and CBN grinding wheels, PCD PCBN tools, Sharpening Stones and Abrasive Tools. We are located in Zhengzhou, the capital of Henan Province, with convenient transportation access. Our company covers an area of 150 square meters. Since the establishment of our company, it has been adhering to people-oriented and innovation. Win the trust of customers with quality and service. Always insist on serving every customer well and be responsible for every customer. Dedicated to strict quality control and thoughtful customer service, our experienced staff members are always available to discuss your requirements, Hear and give you professional advice, and ensure full customer satisfaction. We are committed to providing state-of-the-art diamond and CBN products. Experienced engineers & technical expertise brought their industrial knowledge and technical service to help customer find the best solutions with our diamond and CBN products. Our fully equipped manufacturing facility and advanced detection equipments make our product perform well and consistent. And we never stop persuing new technology and continious improvement Our goais to 100% customer satisfaction. In addition, our products have various certificates required, including Chinese domestic certificates and those required for export to various countries in the world. Selling well in all cities and provinces around China, our products are also exported to clients in such countries and regions as USA, Canada, Russia, etc. We also welcome OEM and ODM orders. Whether selecting a current product from our catalog or seeking engineering assistance for your application, you can talk to our customer service center about your sourcing requirements. If you have any new ideas or concepts for the products, please contact us. We are glad to work together with you and finally bring you the satisfied products. We are waiting for you in Zhengzhou, Look forward to working with you!
About Our Factory & Business Background
- Address
- Room 902, Building3, Longcheng Square, Wenhua North Road, Huiji District, Zhengzhou, Henan, China
- Average Lead Time
-
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Our Industry Experience & Global Business Record
- Main Markets
- North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
FAQ
- What is the minimum order quantity?
- The minimum order quantity is 1 piece.
- Can the blade thickness be customized?
- Yes, the thickness can be customized within the range of 0.1mm to 1mm.
- What materials can this blade cut?
- It is suitable for cutting silicon wafers, glass, quartz, sapphire, ceramic, and other semiconductor materials.
- What are the available bond types?
- We offer Metal bond, Resin bond, and Electroplated bond options.
- How long does delivery take?
- Delivery takes 3 to 30 days after order confirmation, depending on the season and quantity.
- Do you offer OEM and ODM services?
- Yes, we provide full customization and customization from designs.
- What is the precision of the blade?
- The blade features a circular degree of less than 0.1 and cylindricity of less than 0.5.
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