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Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades

Zhengzhou Ruizuan Diamond Tool Co., Ltd.
  • Audited Supplier
  • 4 yrs

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Product Highlights

  • Customizable Size: Size can be customised according to specific requirements.
  • Versatile Material Cutting: Used for grooving and cutting silicon wafers, compound semiconductors, and glass.
  • High Precision: Cylindricity <0.5 and Circular Degree <0.1 for accurate dicing.
  • OEM/ODM Support: Full customization and OEM/ODM services available for designs.
  • Fast Delivery: Delivery within 3-30 days after order confirmation.
  • Wide Application: Suitable for IC wafers, gallium arsenide, ceramic substrates, and more.

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Shipping Cost:
Contact the supplier about freight and estimated delivery time.

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Optional pre-shipment inspection for quality and quantity checks.
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Product Images of Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades

Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades pictures & photos
Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades pictures & photos
Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades pictures & photos
Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades pictures & photos
Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades pictures & photos
Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades pictures & photos
Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
  • Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
  • Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
    Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
  • Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
    Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
  • Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
    Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
  • Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
    Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
  • Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
    Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
  • Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
    Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades

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Product Description

Product Description

Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
Diamond dicing blade
Diamond dicing blade is used for grooving , cutting silicon wafer, compound semiconductors, glass and other materials in electronic information industry. Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade. The binders include resin bond dicing blade, metal bond dicing blade and electroformed nickel dicing blade.This type is electroplated.
Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades
* Size can be customised according to requirements
Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing BladesElectroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing BladesApplication: Scribing dicing IC wafers, gallium arsenide, gallium phosphide, epoxy resin board, alloy frame, ceramic substrate, composite board with interlayer, etc
How to selection of the correct types of wafer dicing blades to cut materials ?
* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material
* Binder of metal bond (medium strength) dicing blade
* Binder of electroplated bond (hard bond), scribing softer material
Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades

Customer Reviews

Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades

Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades

Why Choose Us


Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing BladesElectroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing BladesInternational Leading Trade Fair 
for Grinding Technology
Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades

Company Profile

Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing BladesZhengzhou Ruizuan Diamond Tools Co..Ltd. is committed to providing customers with tools for grinding, cutting, turning, millingdrilling, and reaming. It includes abrasive tools&wheels, diamond/CBN wheels &tools, PCD/PCBNinserts&tools, tungsten carbide inserts &tool, HSS steel tools&cutters.

Our tools are applied in many different industries. Our customers find good applications in woodworking, metalworking, Automotive, Stone, Glasses, gemstones, Industrial ceramic, oil & Gas drilling and Constructions industries. In these industriesour products are performing well on long lifetimehigh-efficiency and lessunit-cost.
Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades

Packaging & Shipping

Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing BladesPACKAGE:
SINGLE BOX PER WHEEL,
10 to 20 WHEELS PER CARTON

DELIVERY TIME:
3-30 days after confirming order,detail delivery date should be decided according to
production season and order quantity.
Electroplated Nickel Bond Dicing Blade Compound Semiconductor Wafers Dicing Blade Nickel Dicing Blades

About the Supplier

This supplier has been audited by SGS. Verify the report on the official SGS website with ID "QIP-ASI239823". Items marked "verified" are certified.

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Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.

About Our Factory & Business Background

verified Business Type
Trading Company
Address
Room 902, Building3, Longcheng Square, Wenhua North Road, Huiji District, Zhengzhou, Henan, China
verified Plant Area
270 square meters
verified Number of Employees
19
verified Registered Capital
500,000 RMB
verified Terms of Payment
LC, T/T, D/P, PayPal, Western Union, Small-amount payment
verified International Commercial Terms(Incoterms)
FOB, CIF, CFR, EXW
verified Average Lead Time
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
verified Nearest Port
Tianjin Port
verified Minimum Order Quantity
1 Pcs
verified Supply Chain Partners
30

Our Production Capability & Technical Expertise

verified Main Products
Hardware Products, Ordinary Mechanical Equipment
verified Customization Options
Full Customization, Customization from Designs
verified ODM Service Available
Yes
verified OEM Service Available
Yes
verified R&D Engineers
3 people

Our Industry Experience & Global Business Record

verified Year of Establishment
2014-08-19
verified Export Year
9 Years
verified Main Markets
North America, Europe, Southeast Asia/ Mideast
verified Repeat Buyers Choice
50%~80%
verified Annual Export Revenue
634,662.7 USD
verified Number of Foreign Trading Staff
11
verified Overseas Agent/Branch
No
verified New Products Launched in Last year
No

Our Certifications, Standards & Industry Recognition

verified Cooperated with Fortune 500
No

FAQ

What materials can this dicing blade cut?
It is used for grooving and cutting silicon wafers, compound semiconductors, glass, gallium arsenide, gallium phosphide, epoxy resin boards, alloy frames, and ceramic substrates.
Is the size of the blade customizable?
Yes, the size can be customised according to specific requirements.
What is the delivery time for orders?
Delivery takes 3-30 days after confirming the order, depending on the production season and order quantity.
What are the precision standards for the blade?
The blade features a Cylindricity of less than 0.5 and a Circular Degree of less than 0.1.
Does the supplier offer OEM or ODM services?
Yes, OEM and ODM services are available, including full customization and customization from designs.
What is the minimum order quantity?
The minimum order quantity is 1 piece.
What payment methods are accepted?
Accepted payment terms include LC, T/T, D/P, PayPal, Western Union, and Small-amount payment.

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