Dicing Blade Hubless Micro Blade for Scribing Electronic Parts Optical Devices and Semiconductor Packages

• Material: Diamond
• Abrasive: Normal Abrasive
• Shapes: Round
• Types: Cutting
• Grain Size: Other
• Cylindricity: <0.5
• Circular Degree: <0.1
• Technics: Sinter
• Working Style: Tool Grinding
• Width: Customized
• Thickness: 0.1-1mm
• Product Name: Resin Bond Diamond Dicing Blade
• Shape: Round Flat Wheel
• Bonding Agent: Electroplated Bond/Resin Bond/Metal Bond
• Usage: Semiconductor Material Cutting
• Application: Cutting Scribing Glass,Quartz, Lita03 Linb03
• Advantage: High Efficient,High Accuracy
• MOQ: 1PCS
• Transport Package: Cartons
• Specification: 50-120mm, customized
• Trademark: RZ
• Origin: China
• Production Capacity: 100000pieces/Year
• Package Size: 20.00cm * 20.00cm * 5.00cm
• Package Gross Weight: 0.300kg

Product Description

Product Description

Diamond dicing blade
Diamond dicing blades are mainly used in the precision manufacturing industry.
According to the structure, it can be divided into the soft blade and hard blade. Generally, the circular sheet grinding wheel is called "soft blade" and the combination of the grinding wheel and the aluminum alloy tool holder is called "hard blade". According to bond, it is divided into metal bond, resin bond, electroplated bond diamond dicing blade..

Type	General shape	Diameter (mm)	Thickness (mm)	Thickness tolerance (mm)	Grain grit size
Metal bond No steel core	1A8, 1A8S	10 ~ 200	0.05 ~ 4.00	±0.002 / ±0.005	100# ~ 3000#
Resin bond No steel core	1A8, 1A8S	50 ~ 153	0.06 ~ 4.00	±0.005 / ±0.008	100#~2000#
Nickel bond Hubless blades	1A8, 1A8S	50 ~ 120	0.02 ~ 0.50	±0.005 / ±0.010	200# ~ 4000#
With Steel core	1A1, 1A1R, 1A1S, 1A1RS	50-400	0.25 ~ 6.00	±0.010 / ±0.020	100# ~ 2000#
Nickel bond Hub blades	3A1, 3A1S	50 ~ 58	0.01 ~ 0.12	±0.005 / ±0.010	320# ~ 5000#

1.Metal bond diamond dicing blades (soft blades) have high strength, good rigidity, long life

2.Resin bond diamond dicing blades(soft blades) has good elasticity, self-sharpening, sharp cutting, good cutting quality

3.Electroplated bond diamond dicing blades (soft blades) feature high strength, good rigidity, good shape retention and long service
life.

1.Metal bond dicing balde Application: Scribing electronic parts, optical devices, semiconductor packages, BGA, CSP, PCB, ceramic, glass, quartz, crystal, ferrite, optical communication (Faraday), etc

2.Resin bond dicing blade Application: cutting scribing glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), BGA, QFN (copper epoxy molding ), splitter, sapphire, ceramic substrate, alumina, aliminum nitride, etc

3.Electroformed dicing balde Application: Scribing dicing silicon wafers, copper wafer and compound semiconductor wafers ( such as GaAs and SiC) , resistance, ceramic, packaging materials, lithium niobate, lithium tantalate, etc

 

Customer Reviews

Why Choose Us

International Leading Trade Fair 
for Grinding Technology

Company Profile

Zhengzhou Ruizuan Diamond Tools Co..Ltd. is committed to providing customers with tools for grinding, cutting, turning, millingdrilling, and reaming. It includes abrasive tools&wheels, diamond/CBN wheels &tools, PCD/PCBNinserts&tools, tungsten carbide inserts &tool, HSS steel tools&cutters.

Our tools are applied in many different industries. Our customers find good applications in woodworking, metalworking, Automotive, Stone, Glasses, gemstones, Industrial ceramic, oil & Gas drilling and Constructions industries. In these industriesour products are performing well on long lifetimehigh-efficiency and lessunit-cost.

Packaging & Shipping

PACKAGE:
SINGLE BOX PER WHEEL,
10 to 20 WHEELS PER CARTON
DELIVERY TIME:
3-30 days after confirming order,detail delivery date should be decided according to
production season and order quantity.