Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer Scribing

Product Details
Material: Diamond
Abrasive: Superabrasive
Shapes: Round
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  • Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer Scribing
  • Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer Scribing
  • Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer Scribing
  • Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer Scribing
  • Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer Scribing
  • Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer Scribing
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  • Overview
  • Product Description
  • Customer Reviews
  • Why Choose Us
  • Company Profile
  • Packaging & Shipping
Overview

Basic Info.

Types
Straight Grinding Wheels
Grain Size
1500-5000grit
Cylindricity
<0.5
Circular Degree
<0.1
Technics
Sinter
Working Style
Tool Grinding
Product Name
Electroplated Diamond Dicing Blade with Hub
Shape
Flat-Shaped
Application
Scribing Dicing IC Wafers, Gallium Arsenide
Applicable Machine
Scribing Machine
Usage
Wafer Dicing
Packing
Carton
Transport Package
Cartons
Specification
customized
Trademark
RZ
Origin
China
Production Capacity
100000pieces/Year

Packaging & Delivery

Package Size
20.00cm * 20.00cm * 10.00cm
Package Gross Weight
0.500kg

Product Description

Product Description

Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer Scribing
Diamond dicing blade
Diamond dicing blade is used for grooving , cutting silicon wafer, compound semiconductors, glass and other materials in electronic information industry. Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade. The binders include resin bond dicing blade, metal bond dicing blade and electroformed nickel dicing blade.This type is electroplated.
Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer Scribing
* Size can be customised according to requirements
Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer ScribingHub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer ScribingApplication: Scribing dicing IC wafers, gallium arsenide, gallium phosphide, epoxy resin board, alloy frame, ceramic substrate, composite board with interlayer, etc
How to selection of the correct types of wafer dicing blades to cut materials ?
* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material
* Binder of metal bond (medium strength) dicing blade
* Binder of electroplated bond (hard bond), scribing softer material
Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer Scribing

Customer Reviews

Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer Scribing

Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer Scribing

Why Choose Us


Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer ScribingHub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer ScribingInternational Leading Trade Fair 
for Grinding Technology
Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer Scribing

Company Profile

Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer ScribingZhengzhou Ruizuan Diamond Tools Co..Ltd. is committed to providing customers with tools for grinding, cutting, turning, millingdrilling, and reaming. It includes abrasive tools&wheels, diamond/CBN wheels &tools, PCD/PCBNinserts&tools, tungsten carbide inserts &tool, HSS steel tools&cutters.

Our tools are applied in many different industries. Our customers find good applications in woodworking, metalworking, Automotive, Stone, Glasses, gemstones, Industrial ceramic, oil & Gas drilling and Constructions industries. In these industriesour products are performing well on long lifetimehigh-efficiency and lessunit-cost.
Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer Scribing

Packaging & Shipping

Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer ScribingPACKAGE:
SINGLE BOX PER WHEEL,
10 to 20 WHEELS PER CARTON

DELIVERY TIME:
3-30 days after confirming order,detail delivery date should be decided according to
production season and order quantity.
Hub Dicing Saw Blade Diamond Dicing Blades 12A1 Wafer Hub Dicing Saw Blade for Wafer Scribing

 

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