Discrete Devices Back Grinding Wheel Silicon Wafers Semiconductor Thinner Fine Grinding Grinding Wheel

• Manufacturing Process: Sintered
• Shape: Cup-Shaped
• Bonding Agent: Vitrified
• Width: 209mm/Customized
• Thickness: 22.5mm/Customized
• Product Name: 6A2 6A2h 6A2t Semiconductor Thinner Grinding Wheel
• Material: Diamond + Aluminum Base
• Usage: Back Grinding
• Application: for The Thinning and Fine Grinding of The Silicon
• Wheel Type: Straight Grinding Wheels,Cup Grinding Wheel
• Applicable Machine: Nts, Shuwa, Engis, Okamoto , Disco, Tsk
• MOQ: 1PCS
• Transport Package: Cartons
• Specification: D209-T22.5-H158-X3-W5 2000#
• Trademark: RZ
• Origin: China
• Production Capacity: 100000pieces/Year
• Package Size: 30.00cm * 30.00cm * 20.00cm
• Package Gross Weight: 1.500kg

Product Description

Product Description

Semiconductor Thinner Grinding WheelBack grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by our institute which possess superior grinding performance and high cost. 
Performance are among the top level worldwide. They can be used with the Japanese, German, American, Korean and Chinese grinders.
Vitrified Bond Back Grinding wheel
This series of vitrified diamond wheel is mainly used for back thinning and precision processing of semiconductor wafers, discrete devices, integrated circuit substrate silicon wafers, and raw silicon wafers.
Resin Bond Back Grinding Wheel
Resin bond back grinding wheel is made from thermoset resin and diamond, which is used for silicon wafers, sapphire, gallium nitride, gallium arsenide.

Model	D (mm)	T (mm)	H (mm)
6A2/6A2H	175	30, 35	76
	200	35	76
	350	45	127
6A2T	195	22.5, 25	170
	280	30	228.6
6A2T(three ellipses)	350	35	235
	209	22.5	158
Other specifications can be produced according to customers' requirement.

Advantages of back grinding wheel
1. With low damage and high quality
2.Nodeless consecutive processing is possible by the superior sharpness
3. It helps minimize processing damage,improve processing efficiency and reduce processing cost, and is customizable according to customer needs

1.Applications of back grinding wheel: Back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, arsenide, GaN wafers, silicon-based chips, etc

2. Workpiece processed: silicon wafer of discrete devices, integrated chips(IC) and virgin etc.

3. Workpiece materials: monocrystalline silicon, gallium arsenide, indium phosphide, silicon carbide and other semiconductor materials.

4. Applications: back thinning, rough grinding and fine grinding

5.Applicable Grinding Machine:The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders ( Such as NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH grinding machine, etc ).

Customer Reviews

Why Choose Us

International Leading Trade Fair 
for Grinding Technology

Company Profile

Zhengzhou Ruizuan Diamond Tools Co..Ltd. is committed to providing customers with tools for grinding, cutting, turning, millingdrilling, and reaming. It includes abrasive tools&wheels, diamond/CBN wheels &tools, PCD/PCBNinserts&tools, tungsten carbide inserts &tool, HSS steel tools&cutters.

Our tools are applied in many different industries. Our customers find good applications in woodworking, metalworking, Automotive, Stone, Glasses, gemstones, Industrial ceramic, oil & Gas drilling and Constructions industries. In these industriesour products are performing well on long lifetimehigh-efficiency and lessunit-cost.

Packaging & Shipping

PACKAGE:
SINGLE BOX PER WHEEL,
10 to 20 WHEELS PER CARTON
DELIVERY TIME:
3-30 days after confirming order,detail delivery date should be decided according to
production season and order quantity.