Solar Photovoltaic Industry Grinding Wheel Resin Bond Cup Grinding Wheel for Polysilicon Chamfering Grinding

• Manufacturing Process: Brazing
• Shape: Cup-Shaped
• Bonding Agent: Resin
• Size: 209mm,254mm,313mm,Customized
• Grit: Rough Grinding ,Fine Grinding
• Material: Diamond + Aluminum Base
• Product Name: Grinding Wheels for Photovoltaic Industry
• Application: for Silicon Wafers, Sapphire, Gallium Nitride
• Usage: for Flat Grinding and Chamfering
• Keyword: Edge Grinding Wheel
• Bond: Resin Bonding,Vitrified Bond
• Packing: Carton
• Transport Package: Cartons
• Specification: 209mm, 254mm, 313mm
• Trademark: RZ
• Origin: China
• Production Capacity: 100000pieces/Year
• Package Size: 25.00cm * 25.00cm * 25.00cm
• Package Gross Weight: 3.000kg

Product Description

Product Description

Grinding Wheels for Photovoltaic Industry
A silicon wafer grinding wheel is a specialized tool used in the semiconductor industry for thinning and shaping silicon wafers. Silicon wafers are used as a substrate for the fabrication of integrated circuits and other electronic components.
Grinding wheels used for silicon wafer thinning are typically made of diamond abrasive material. Diamond is an extremely hard material that is capable of effectively grinding and shaping silicon, which is also a hard material. The diamond abrasive particles are bonded together with a metal matrix, forming the grinding wheel.

Shape code	Conventional specification(mm)
	D	T	H	X(W)
6A2T	220	65	130	5
6A2H	200	35	76	5
	200	60	80	5
11A2	100	28.40	31.75,20	5
1A1	300	35	127	5,7,10
6B9H/C	300	50	48	10,20
6A2T/C	250	60	38.1	10,15

Features of cylindrical grinding wheel for silicon ingot

 

1.Realizes a total-like cost cut by fast material removal

2.Minimal influence on crystalline structure
3.Low grinding load, good grinding performance and wear resistance 4.Ingot surface with a high flat degree.
5.Low dressing frequency

Mainly used for flat grinding and chamfering of polycrystalline silicon; flat and cylindrical grinding monocrystalline silicon.

Grinding Objects: Sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers. Work Piece Materials: Synthetic sapphire, monocrystalline silicon, gallium arsenide and gallium nitride.

 

Customer Reviews

Why Choose Us

International Leading Trade Fair 
for Grinding Technology

Company Profile

Zhengzhou Ruizuan Diamond Tools Co..Ltd. is committed to providing customers with tools for grinding, cutting, turning, millingdrilling, and reaming. It includes abrasive tools&wheels, diamond/CBN wheels &tools, PCD/PCBNinserts&tools, tungsten carbide inserts &tool, HSS steel tools&cutters.

Our tools are applied in many different industries. Our customers find good applications in woodworking, metalworking, Automotive, Stone, Glasses, gemstones, Industrial ceramic, oil & Gas drilling and Constructions industries. In these industriesour products are performing well on long lifetimehigh-efficiency and lessunit-cost.

Packaging & Shipping

PACKAGE:
SINGLE BOX PER WHEEL,
10 to 20 WHEELS PER CARTON
DELIVERY TIME:
3-30 days after confirming order,detail delivery date should be decided according to
production season and order quantity.