GaN Wafers Grinding Original Silicon Wafers Back Grinding Wheel Back Thinning Diamond Grinding Wheel
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Product Highlights
- Customizable Dimensions: Width and thickness are fully customizable to meet specific customer requirements.
- High Precision Grinding: Ensures low damage, high quality, and nodeless consecutive processing for silicon wafers.
- Wide Machine Compatibility: Compatible with major brands including NTS, SHUWA, ENGIS, Okamoto, Disco, and TSK.
- Versatile Material Application: Suitable for silicon, sapphire, GaN, GaAs, and other semiconductor materials.
- Low MOQ Requirement: Minimum order quantity is just 1 piece, allowing for flexible trial orders.
- Superior Performance: Top-level worldwide performance with high efficiency and reduced processing costs.
- Full Customization Service: Offers full customization from designs, including OEM and ODM services.
- Fast Delivery Options: Delivery within 3-30 days, with off-season lead time under 15 workdays.
Product Attributes
- Customization
- Available
- Manufacturing Process
- Sintered
- Shape
- Cup-Shaped
- Bonding Agent
- Vitrified
- Width
- 209mm/Customized
- Thickness
- 22.5mm/Customized
- Product Name
- 6A2 6A2h 6A2t Semiconductor Thinner Grinding Wheel
- Material
- Diamond + Aluminum Base
- Usage
- Back Grinding
- Application
- for The Thinning and Fine Grinding of The Silicon
- Wheel Type
- Straight Grinding Wheels,Cup Grinding Wheel
- Applicable Machine
- Nts, Shuwa, Engis, Okamoto , Disco, Tsk
- MOQ
- 1PCS
- Transport Package
- Cartons
- Specification
- D209-T22.5-H158-X3-W5 2000#
- Trademark
- RZ
- Origin
- China
- Production Capacity
- 100000pieces/Year
- Package Size
- 30.00cm * 30.00cm * 20.00cm
- Package Gross Weight
- 1.500kg
Shipping
- Shipping Cost:
- Contact the supplier about freight and estimated delivery time.
Online Trading Protection
- Payment Guarantee
-
Platform-protected payments with refund support for eligible order issues.
- Platform Logistics
- Clearer shipment tracking with platform-supported logistics.
- Inspection Service
- Optional pre-shipment inspection for quality and quantity checks.
- After-Sales & Dispute Handling
- Platform-assisted dispute resolution, including refunds or returns when applicable.
Only orders placed and paid through Made-in-China.com Secured Trading are eligible for payment protection and the corresponding platform services.
Product Images of GaN Wafers Grinding Original Silicon Wafers Back Grinding Wheel Back Thinning Diamond Grinding Wheel
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GaN Wafers Grinding Original Silicon Wafers Back Grinding Wheel Back Thinning Diamond Grinding Wheel -
GaN Wafers Grinding Original Silicon Wafers Back Grinding Wheel Back Thinning Diamond Grinding Wheel -
GaN Wafers Grinding Original Silicon Wafers Back Grinding Wheel Back Thinning Diamond Grinding Wheel -
GaN Wafers Grinding Original Silicon Wafers Back Grinding Wheel Back Thinning Diamond Grinding Wheel -
GaN Wafers Grinding Original Silicon Wafers Back Grinding Wheel Back Thinning Diamond Grinding Wheel -
GaN Wafers Grinding Original Silicon Wafers Back Grinding Wheel Back Thinning Diamond Grinding Wheel -
GaN Wafers Grinding Original Silicon Wafers Back Grinding Wheel Back Thinning Diamond Grinding Wheel
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Product Description
Semiconductor Thinner Grinding WheelBack grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by our institute which possess superior grinding performance and high cost.
Performance are among the top level worldwide. They can be used with the Japanese, German, American, Korean and Chinese grinders.
Vitrified Bond Back Grinding wheel
This series of vitrified diamond wheel is mainly used for back thinning and precision processing of semiconductor wafers, discrete devices, integrated circuit substrate silicon wafers, and raw silicon wafers.
Resin Bond Back Grinding Wheel
Resin bond back grinding wheel is made from thermoset resin and diamond, which is used for silicon wafers, sapphire, gallium nitride, gallium arsenide.
|
Model
|
D (mm)
|
T (mm)
|
H (mm)
|
|
6A2/6A2H |
175
|
30, 35
|
76
|
|
200
|
35
|
76
|
|
|
350
|
45
|
127
|
|
|
6A2T |
195
|
22.5, 25
|
170
|
|
280
|
30
|
228.6
|
|
|
6A2T(three ellipses) |
350
|
35
|
235
|
|
209
|
22.5
|
158
|
|
|
Other specifications can be produced according to customers' requirement.
|
|||
Advantages of back grinding wheel
1. With low damage and high quality
2.Nodeless consecutive processing is possible by the superior sharpness
3. It helps minimize processing damage,improve processing efficiency and reduce processing cost, and is customizable according to customer needs
1.Applications of back grinding wheel: Back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, arsenide, GaN wafers, silicon-based chips, etc
International Leading Trade Fair
for Grinding Technology
Zhengzhou Ruizuan Diamond Tools Co..Ltd. is committed to providing customers with tools for grinding, cutting, turning, millingdrilling, and reaming. It includes abrasive tools&wheels, diamond/CBN wheels &tools, PCD/PCBNinserts&tools, tungsten carbide inserts &tool, HSS steel tools&cutters.
Our tools are applied in many different industries. Our customers find good applications in woodworking, metalworking, Automotive, Stone, Glasses, gemstones, Industrial ceramic, oil & Gas drilling and Constructions industries. In these industriesour products are performing well on long lifetimehigh-efficiency and lessunit-cost.
PACKAGE:
SINGLE BOX PER WHEEL,
10 to 20 WHEELS PER CARTON
DELIVERY TIME:
3-30 days after confirming order,detail delivery date should be decided according to
production season and order quantity.
About the Supplier
This supplier has been audited by TÜV Rheinland. Verify the report on the official TÜV Rheinland website with ID "MIC-ASR2691200". Items marked "
" are certified.
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Company Profile
Zhengzhou Ruizuan Diamond Tool Co., Ltd., established in 2014, is a professional engaged in the research, development, sale and service of Grinding Wheel, Metal Cutting Tools, Diamond and CBN grinding wheels, PCD PCBN tools, Sharpening Stones and Abrasive Tools. We are located in Zhengzhou, the capital of Henan Province, with convenient transportation access. Our company covers an area of 150 square meters. Since the establishment of our company, it has been adhering to people-oriented and innovation. Win the trust of customers with quality and service. Always insist on serving every customer well and be responsible for every customer. Dedicated to strict quality control and thoughtful customer service, our experienced staff members are always available to discuss your requirements, Hear and give you professional advice, and ensure full customer satisfaction. We are committed to providing state-of-the-art diamond and CBN products. Experienced engineers & technical expertise brought their industrial knowledge and technical service to help customer find the best solutions with our diamond and CBN products. Our fully equipped manufacturing facility and advanced detection equipments make our product perform well and consistent. And we never stop persuing new technology and continious improvement Our goais to 100% customer satisfaction. In addition, our products have various certificates required, including Chinese domestic certificates and those required for export to various countries in the world. Selling well in all cities and provinces around China, our products are also exported to clients in such countries and regions as USA, Canada, Russia, etc. We also welcome OEM and ODM orders. Whether selecting a current product from our catalog or seeking engineering assistance for your application, you can talk to our customer service center about your sourcing requirements. If you have any new ideas or concepts for the products, please contact us. We are glad to work together with you and finally bring you the satisfied products. We are waiting for you in Zhengzhou, Look forward to working with you!
About Our Factory & Business Background
- Address
- Room 902, Building3, Longcheng Square, Wenhua North Road, Huiji District, Zhengzhou, Henan, China
- Average Lead Time
-
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Our Industry Experience & Global Business Record
- Main Markets
- North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
FAQ
- What is the minimum order quantity?
- The minimum order quantity is 1 piece.
- Which grinding machines are compatible with this wheel?
- It is compatible with Japanese, German, American, Korean, and Chinese grinders, such as NTS, SHUWA, ENGIS, Okamoto, Disco, TSK, and STRASBAUGH.
- Can the wheel dimensions be customized?
- Yes, the width and thickness are fully customizable according to customer requirements.
- What materials can be processed with this grinding wheel?
- It is suitable for monocrystalline silicon, gallium arsenide, indium phosphide, silicon carbide, sapphire, and other semiconductor materials.
- What is the delivery time for orders?
- Delivery takes 3-30 days after order confirmation. Off-season lead time is within 15 workdays, while peak season may take one month.
- What payment methods are accepted?
- We accept LC, T/T, D/P, PayPal, Western Union, and small-amount payments.
- Does the company offer OEM or ODM services?
- Yes, both OEM and ODM services are available with full customization options from designs.
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