Secured Trading Service

Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel

Zhengzhou Ruizuan Diamond Tool Co., Ltd.
  • Audited Supplier
  • 4 yrs

Contact Supplier

Product Highlights

  • High Precision Grinding: Ensures high precision of the ground workpiece and good surface quality.
  • High Efficiency & Low Heat: Features high grinding efficiency with low grinding force and low temperature.
  • Wide Material Compatibility: Suitable for synthetic sapphire, SiC, and single crystal silicon wafers.
  • Customizable Dimensions: Available in 209mm, 254mm, 313mm, or fully customized sizes.
  • Universal Machine Fit: Works well with major brands like Ts, Shuwa, Engis, Okamoto, and Disco.
  • Cost-Effective Performance: Superior grinding performance with high cost-effectiveness for LED industry.
  • Low MOQ Requirement: Minimum order quantity is just 1 piece for flexible purchasing.
  • Durable Metal Bond: Constructed with metal bonding agent for good shape retention.

Shipping

Shipping Cost:
Contact the supplier about freight and estimated delivery time.

Online Trading Protection

Payment Guarantee
T/T PayPal ApplePay GooglePay visa mastercard american express discover JCB diners club PIX SPEI OXXO PSE OZOW Platform-protected payments with refund support for eligible order issues.
Platform Logistics
Clearer shipment tracking with platform-supported logistics.
Inspection Service
Optional pre-shipment inspection for quality and quantity checks.
After-Sales & Dispute Handling
Platform-assisted dispute resolution, including refunds or returns when applicable.

Only orders placed and paid through Made-in-China.com Secured Trading are eligible for payment protection and the corresponding platform services.

Product Images of Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel

Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel pictures & photos
Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel pictures & photos
Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel pictures & photos
Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel pictures & photos
Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel pictures & photos
Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel pictures & photos
Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
  • Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
  • Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
    Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
  • Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
    Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
  • Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
    Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
  • Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
    Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
  • Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
    Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
  • Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
    Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel

Find Similar Products

Product Description

Product Description

Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel

LED Substrate Metal Back Grinding WheelThe diamond back grinding wheel is widely used in the electronics industry such as LED chips and integrated circuit silicon wafers, which is mainly for back thinning and grinding semiconductor wafers.Diamond grinding wheels are the only option.
LED industry for back grinding of sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers. It works well with European, American, Japanese and Chinese grinding machines with an excellent performance and cost effectiveness.

Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel

Product Name
Back Grinding Wheel for LED Substrate
Bond
Metal
Shape
6A2T
Size
209mm,254mm,313mm,customized
Appliances
Synthetic sapphire, SiC,single crystal silicon

Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel

1.High precision of the ground workpiece and good surface quality
2.Good shape retention of the workpiece
3.High grinding efficiency
4.Low grinding force and low grinding temperature

Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel
1.Metal diamond grinding wheel is mainly used for back thinning of sapphire epitaxial wafers, silicon chips, gallium arsenide, and GaN chips in the LED industry. The back grinding wheel for LED substrate has been exported to many countries, with superior grinding performance and high cost-effectiveness.
2. Workpiece processed: sapphire epitaxial wafer, SiC Substrate epitaxial wafer, Si Substrate epitaxial wafer.
3.Material of workpiece: Synthetic sapphire, SiC,single crystal silicon.
4.Grinders: SHUWA , NTS , WEC , GALAXY ,SPEEDFAM ,OKAMOTO.
Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel

Customer Reviews

Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel

Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel

Why Choose Us


Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding WheelCustomized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding WheelInternational Leading Trade Fair 
for Grinding Technology
Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel

Company Profile

Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding WheelZhengzhou Ruizuan Diamond Tools Co..Ltd. is committed to providing customers with tools for grinding, cutting, turning, millingdrilling, and reaming. It includes abrasive tools&wheels, diamond/CBN wheels &tools, PCD/PCBNinserts&tools, tungsten carbide inserts &tool, HSS steel tools&cutters.

Our tools are applied in many different industries. Our customers find good applications in woodworking, metalworking, Automotive, Stone, Glasses, gemstones, Industrial ceramic, oil & Gas drilling and Constructions industries. In these industriesour products are performing well on long lifetimehigh-efficiency and lessunit-cost.
Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel

Packaging & Shipping

Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding WheelPACKAGE:
SINGLE BOX PER WHEEL,
10 to 20 WHEELS PER CARTON

DELIVERY TIME:
3-30 days after confirming order,detail delivery date should be decided according to
production season and order quantity.
Customized Silicon Wafer and Carborundum Wafer Back Thinning Diamond Grinding Wheel Back Grinding Wheel

About the Supplier

This supplier has been audited by TÜV Rheinland. Verify the report on the official TÜV Rheinland website with ID "MIC-ASR2691200". Items marked "verified" are certified.

Watch Video
Watch Video
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.

About Our Factory & Business Background

Address
Room 902, Building3, Longcheng Square, Wenhua North Road, Huiji District, Zhengzhou, Henan, China
Average Lead Time
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month

Our Production Capability & Technical Expertise

Main Products
Hardware Products, Ordinary Mechanical Equipment, Diamond Grinding Wheel, CBN Grinding Wheel, Abrasive Grinding Wheel, Cutting Wheels, PCD PCBN Cutting Tools, Mcd Cutting Tools

Our Industry Experience & Global Business Record

Main Markets
North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe

FAQ

What materials can this grinding wheel process?
It is applicable for synthetic sapphire, SiC, and single crystal silicon wafers, mainly used for back thinning in the LED industry.
Is the size customizable?
Yes, the wheel is available in standard sizes of 209mm, 254mm, and 313mm, and can also be fully customized.
What is the minimum order quantity?
The MOQ is 1 piece, allowing for flexible purchasing options.
Which grinding machines are compatible?
It works well with European, American, Japanese, and Chinese grinding machines, including brands like Ts, Shuwa, Engis, Okamoto, and Disco.
What is the delivery time?
Delivery takes 3-30 days after confirming the order, depending on the production season and order quantity.
What are the main advantages of this wheel?
Key features include high precision, good surface quality, high grinding efficiency, low grinding force, low temperature, and good shape retention.
What payment methods are accepted?
We accept LC, T/T, D/P, PayPal, Western Union, and small-amount payments.

Send your message to this supplier

Contact Information
Recipient
Message

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now

Product Groups

Product Catalogs