Diamond dicing blade
Diamond dicing blade is used for grooving , cutting silicon wafer, compound semiconductors, glass and other materials in electronic information industry. Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade. The binders include resin bond dicing blade, metal bond dicing blade and electroformed nickel dicing blade.This type is electroplated.
* Size can be customised according to requirements |
Application: Scribing dicing IC wafers, gallium arsenide, gallium phosphide, epoxy resin board, alloy frame, ceramic substrate, composite board with interlayer, etc
How to selection of the correct types of wafer dicing blades to cut materials ?
* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material
* Binder of metal bond (medium strength) dicing blade
* Binder of electroplated bond (hard bond), scribing softer material
International Leading Trade Fair
for Grinding Technology
Zhengzhou Ruizuan Diamond Tools Co..Ltd. is committed to providing customers with tools for grinding, cutting, turning, millingdrilling, and reaming. It includes abrasive tools&wheels, diamond/CBN wheels &tools, PCD/PCBNinserts&tools, tungsten carbide inserts &tool, HSS steel tools&cutters.
Our tools are applied in many different industries. Our customers find good applications in woodworking, metalworking, Automotive, Stone, Glasses, gemstones, Industrial ceramic, oil & Gas drilling and Constructions industries. In these industriesour products are performing well on long lifetimehigh-efficiency and lessunit-cost.
PACKAGE:
SINGLE BOX PER WHEEL,
10 to 20 WHEELS PER CARTON
DELIVERY TIME:
3-30 days after confirming order,detail delivery date should be decided according to
production season and order quantity.