High Quality Diamond Grinding Wheel for LED Substrate for Back Thinning of Sapphire Epitaxial Wafer

• Manufacturing Process: Brazing
• Shape: Round
• Bonding Agent: Metal
• Width: 209mm,254mm,313mm,Customized
• Thickness: Customized
• Product Name: LED Substrate Metal Back Grinding Wheel
• Material: Diamond + Aluminum Base
• Usage: for Back Thinning of Different Type Wafer
• Applicable Materials: Synthetic Sapphire, Sic,Single Crystal Silicon
• Application: for Back Thinning of Sapphire Epitaxial Wafer
• Applicable Machine: Ts, Shuwa, Engis, Okamoto , Disco
• MOQ: 1PCS
• Transport Package: Cartons
• Specification: 209mm, 254mm, 313mm, customized
• Trademark: RZ
• Origin: China
• Production Capacity: 100000pieces/Year
• Package Size: 30.00cm * 30.00cm * 20.00cm
• Package Gross Weight: 2.000kg

Product Description

Product Description

LED Substrate Metal Back Grinding WheelThe diamond back grinding wheel is widely used in the electronics industry such as LED chips and integrated circuit silicon wafers, which is mainly for back thinning and grinding semiconductor wafers.Diamond grinding wheels are the only option.
LED industry for back grinding of sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers. It works well with European, American, Japanese and Chinese grinding machines with an excellent performance and cost effectiveness.

Product Name	Back Grinding Wheel for LED Substrate
Bond	Metal
Shape	6A2T
Size	209mm,254mm,313mm,customized
Appliances	Synthetic sapphire, SiC,single crystal silicon

1.High precision of the ground workpiece and good surface quality
2.Good shape retention of the workpiece
3.High grinding efficiency
4.Low grinding force and low grinding temperature

1.Metal diamond grinding wheel is mainly used for back thinning of sapphire epitaxial wafers, silicon chips, gallium arsenide, and GaN chips in the LED industry. The back grinding wheel for LED substrate has been exported to many countries, with superior grinding performance and high cost-effectiveness.

2. Workpiece processed: sapphire epitaxial wafer, SiC Substrate epitaxial wafer, Si Substrate epitaxial wafer.

3.Material of workpiece: Synthetic sapphire, SiC,single crystal silicon.

4.Grinders: SHUWA , NTS , WEC , GALAXY ,SPEEDFAM ,OKAMOTO.

Customer Reviews

Why Choose Us

International Leading Trade Fair 
for Grinding Technology

Company Profile

Zhengzhou Ruizuan Diamond Tools Co..Ltd. is committed to providing customers with tools for grinding, cutting, turning, millingdrilling, and reaming. It includes abrasive tools&wheels, diamond/CBN wheels &tools, PCD/PCBNinserts&tools, tungsten carbide inserts &tool, HSS steel tools&cutters.

Our tools are applied in many different industries. Our customers find good applications in woodworking, metalworking, Automotive, Stone, Glasses, gemstones, Industrial ceramic, oil & Gas drilling and Constructions industries. In these industriesour products are performing well on long lifetimehigh-efficiency and lessunit-cost.

Packaging & Shipping

PACKAGE:
SINGLE BOX PER WHEEL,
10 to 20 WHEELS PER CARTON
DELIVERY TIME:
3-30 days after confirming order,detail delivery date should be decided according to
production season and order quantity.