Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
Product Details
| Manufacturing Process: | Sintered |
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| Shape: | Cup-Shaped |
| Bonding Agent: | Vitrified |
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Basic Info.
- Width
- 209mm/Customized
- Thickness
- 22.5mm/Customized
- Product Name
- 6A2 6A2h 6A2t Semiconductor Thinner Grinding Wheel
- Material
- Diamond + Aluminum Base
- Usage
- Back Grinding
- Application
- for The Thinning and Fine Grinding of The Silicon
- Wheel Type
- Straight Grinding Wheels,Cup Grinding Wheel
- Applicable Machine
- Nts, Shuwa, Engis, Okamoto , Disco, Tsk
- MOQ
- 1PCS
- Transport Package
- Cartons
- Specification
- D209-T22.5-H158-X3-W5 2000#
- Trademark
- RZ
- Origin
- China
- Production Capacity
- 100000pieces/Year
Packaging & Delivery
- Package Size
- 30.00cm * 30.00cm * 20.00cm
- Package Gross Weight
- 1.500kg
Product Description
Semiconductor Thinner Grinding WheelBack grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by our institute which possess superior grinding performance and high cost.
Performance are among the top level worldwide. They can be used with the Japanese, German, American, Korean and Chinese grinders.
Vitrified Bond Back Grinding wheel
This series of vitrified diamond wheel is mainly used for back thinning and precision processing of semiconductor wafers, discrete devices, integrated circuit substrate silicon wafers, and raw silicon wafers.
Resin Bond Back Grinding Wheel
Resin bond back grinding wheel is made from thermoset resin and diamond, which is used for silicon wafers, sapphire, gallium nitride, gallium arsenide.
|
Model
|
D (mm)
|
T (mm)
|
H (mm)
|
|
6A2/6A2H |
175
|
30, 35
|
76
|
|
200
|
35
|
76
|
|
|
350
|
45
|
127
|
|
|
6A2T |
195
|
22.5, 25
|
170
|
|
280
|
30
|
228.6
|
|
|
6A2T(three ellipses) |
350
|
35
|
235
|
|
209
|
22.5
|
158
|
|
|
Other specifications can be produced according to customers' requirement.
|
|||
Advantages of back grinding wheel
1. With low damage and high quality
2.Nodeless consecutive processing is possible by the superior sharpness
3. It helps minimize processing damage,improve processing efficiency and reduce processing cost, and is customizable according to customer needs
1.Applications of back grinding wheel: Back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, arsenide, GaN wafers, silicon-based chips, etc
2. Workpiece processed: silicon wafer of discrete devices, integrated chips(IC) and virgin etc.
3. Workpiece materials: monocrystalline silicon, gallium arsenide, indium phosphide, silicon carbide and other semiconductor materials.
4. Applications: back thinning, rough grinding and fine grinding
5.Applicable Grinding Machine:The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders ( Such as NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH grinding machine, etc ).
International Leading Trade Fair
for Grinding Technology
Zhengzhou Ruizuan Diamond Tools Co..Ltd. is committed to providing customers with tools for grinding, cutting, turning, millingdrilling, and reaming. It includes abrasive tools&wheels, diamond/CBN wheels &tools, PCD/PCBNinserts&tools, tungsten carbide inserts &tool, HSS steel tools&cutters.
Our tools are applied in many different industries. Our customers find good applications in woodworking, metalworking, Automotive, Stone, Glasses, gemstones, Industrial ceramic, oil & Gas drilling and Constructions industries. In these industriesour products are performing well on long lifetimehigh-efficiency and lessunit-cost.
PACKAGE:
SINGLE BOX PER WHEEL,
10 to 20 WHEELS PER CARTON
DELIVERY TIME:
3-30 days after confirming order,detail delivery date should be decided according to
production season and order quantity.
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