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Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels

Zhengzhou Ruizuan Diamond Tool Co., Ltd.
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  • 4 yrs

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Product Images of Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels

Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels pictures & photos
Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels pictures & photos
Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels pictures & photos
Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels pictures & photos
Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels pictures & photos
Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels pictures & photos
Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
  • Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
  • Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
    Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
  • Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
    Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
  • Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
    Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
  • Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
    Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
  • Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
    Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
  • Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels
    Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels

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Product Description

Product Description

Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels

Semiconductor Thinner Grinding WheelBack grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by our institute which possess superior grinding performance and high cost. 
Performance are among the top level worldwide. They can be used with the Japanese, German, American, Korean and Chinese grinders.
Vitrified Bond Back Grinding wheel
This series of vitrified diamond wheel is mainly used for back thinning and precision processing of semiconductor wafers, discrete devices, integrated circuit substrate silicon wafers, and raw silicon wafers.
Resin Bond Back Grinding Wheel
Resin bond back grinding wheel is made from thermoset resin and diamond, which is used for silicon wafers, sapphire, gallium nitride, gallium arsenide.

Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels

Model
D (mm)
T (mm)
H (mm)

6A2/6A2H
175
30, 35
76
200
35
76
350
45
127

6A2T
195
22.5, 25
170
280
30
228.6

6A2T(three ellipses)
350
35
235
209
22.5
158
Other specifications can be produced according to customers' requirement.

Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels

Advantages of back grinding wheel
1. With low damage and high quality
2.Nodeless consecutive processing is possible by the superior sharpness
3. It helps minimize processing damage,improve processing efficiency and reduce processing cost, and is customizable according to customer needs

Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels1.Applications of back grinding wheel: Back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, arsenide, GaN wafers, silicon-based chips, etc
2. Workpiece processed: silicon wafer of discrete devices, integrated chips(IC) and virgin etc.
3. Workpiece materials: monocrystalline silicon, gallium arsenide, indium phosphide, silicon carbide and other semiconductor materials.
4. Applications: back thinning, rough grinding and fine grinding
5.Applicable Grinding Machine:The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders ( Such as NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH grinding machine, etc ).
Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels

 

Customer Reviews

Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels

Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels

Why Choose Us


Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding WheelsVitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding WheelsInternational Leading Trade Fair 
for Grinding Technology
Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels

Company Profile

Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding WheelsZhengzhou Ruizuan Diamond Tools Co..Ltd. is committed to providing customers with tools for grinding, cutting, turning, millingdrilling, and reaming. It includes abrasive tools&wheels, diamond/CBN wheels &tools, PCD/PCBNinserts&tools, tungsten carbide inserts &tool, HSS steel tools&cutters.

Our tools are applied in many different industries. Our customers find good applications in woodworking, metalworking, Automotive, Stone, Glasses, gemstones, Industrial ceramic, oil & Gas drilling and Constructions industries. In these industriesour products are performing well on long lifetimehigh-efficiency and lessunit-cost.
Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels

Packaging & Shipping

Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding WheelsPACKAGE:
SINGLE BOX PER WHEEL,
10 to 20 WHEELS PER CARTON

DELIVERY TIME:
3-30 days after confirming order,detail delivery date should be decided according to
production season and order quantity.
Vitrified Bond Cup Wheel Back Grinding Wheel for Sapphire and Sic Wafers Grinding Back Grinding Wheels

About the Supplier

This supplier has been audited by TÜV Rheinland. Verify the report on the official TÜV Rheinland website with ID "MIC-ASR2691200". Items marked "verified" are certified.

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Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.
Zhengzhou Ruizuan Diamond Tool Co., Ltd.

About Our Factory & Business Background

Address
Room 902, Building3, Longcheng Square, Wenhua North Road, Huiji District, Zhengzhou, Henan, China
Average Lead Time
Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month

Our Production Capability & Technical Expertise

Main Products
Hardware Products, Ordinary Mechanical Equipment, Diamond Grinding Wheel, CBN Grinding Wheel, Abrasive Grinding Wheel, Cutting Wheels, PCD PCBN Cutting Tools, Mcd Cutting Tools

Our Industry Experience & Global Business Record

Main Markets
North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe

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